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Metal mask special processing: half-etching treatment

You can freely adjust it by performing step cutting on the ski surface at any desired depth!

This is an introduction to our special processing, "Half Etching Treatment." Half Etching Treatment allows for flexible adjustment of the cream solder amount by creating a stepped recess on the squeegee surface at a desired depth when you want to reduce the amount of cream solder for different components within the same plate. Additionally, when you want to prevent solder adhesion due to plate bleeding on areas like gold terminals, half processing on the back of the mask is effective. 【Features】 ■ Position accuracy: ±0.05mm ■ Half etching board thickness accuracy: ±0.01mm ■ Delivery time: Standard processing time + 1 day *For more details, please refer to the PDF document or feel free to contact us.

  • Other surface treatment equipment
  • Special Processing Machinery
  • Other processing machines

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[Column] About Half Etching Process

A thorough explanation of half-etching! Introducing its uses and applications.

In this column, we will introduce the "half-etching process" of the metal mask option processing series. In recent times, as substrates become lighter and more compact, chip components are getting smaller and smaller, while the components that require solder volume remain unchanged. Isn't it common to wonder, "Even though it’s mounted on a 0603, how do we handle the thickness of the Samtec connector?" In such situations, the half-etching process that we will explain this time comes into play. [Contents] ■ What is "etching" in the first place? ■ What is "half" etching in the first place? ■ How half-etching is used ■ Applications of half-etching *For detailed information about the column, please refer to the related links. For more details, feel free to contact us.

  • Printed Circuit Board

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